HIGH THROUGHPUT BANDSAW

The present disclosure provides for an apparatus for using continuous, preferably smooth, bandsaw blades to cut a substrate. The current disclosure also discloses using the same for preparing a safe and efficient method for cutting substrates into rolls.

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	KRAUTKRAMER, Robert E, MARKEL, John Andrew W, MAIGATTER, Matthew J, BAGGOT, James L, WILSON, Matthew R
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	COMPONENTS OR ACCESSORIES THEREFOR NAILING OR STAPLING MACHINES IN GENERAL PERFORMING OPERATIONS SAWS FOR WOOD OR SIMILAR MATERIAL TRANSPORTING WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The present disclosure provides for an apparatus for using continuous, preferably smooth, bandsaw blades to cut a substrate. The current disclosure also discloses using the same for preparing a safe and efficient method for cutting substrates into rolls.