ELECTRIC CIRCUIT ARRANGEMENT FOR A POWER CONVERTER

ELECTRIC CIRCUIT ARRANGEMENT FOR A POWER CONVERTER

The invention relates to an electric circuit arrangement (1) for a power electronics module (30). The circuit arrangement (1) comprises a substrate (5) with a first layer (2a) from an electrically insulating material, which forms a topside (3) of the substrate (5), and with a second layer comprising...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: CLOSA KOBAYASHI, Alejandro Hiroshi, PARDO PERIS, Juan Francisco, ESMORIS BERTOA, Antón, JORDAN HERRERO, Donato, GONZALEZ ESPIN, Francisco
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CONTROL OR REGULATION THEREOF
CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER
CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERATION
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:The invention relates to an electric circuit arrangement (1) for a power electronics module (30). The circuit arrangement (1) comprises a substrate (5) with a first layer (2a) from an electrically insulating material, which forms a topside (3) of the substrate (5), and with a second layer comprising a layer from an electrically insulating material, which forms an underside (4) of the substrate (5). Between the first and second layers (2a, 2b) a shielding layer (2c) from an electrically conductive material is provided. On the topside (3) of the substrate (5) at least one transistor (6) is arranged, which comprises a source terminal (14a), a drain terminal (14b) and a gate terminal (14c). On the underside (4) of the substrate (5) a cooling body (7) is arranged, which is thermally connected via the substrate (5) to the at least one transistor (6). The at least one transistor (6) is electrically connected via a bond connection (12) to the shielding layer (2c).