SILICONE-BASED ADHESIVE SHEET, MULTILAYER STRUCTURE INCLUDING SAME, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

[Problem] To provide: a layered body wherein a sheet surface has slight adhesiveness, enabling easy temporary securing of a semiconductor chip, or the like, that has been diced, onto a semiconductor substrate, and wherein permanent adhesion to an adhered object is expressed through post-curing; a la...

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Bibliographische Detailangaben
Hauptverfasser:	SUTOH, Manabu, TODA, Nohno
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MICROSTRUCTURAL TECHNOLOGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SEMICONDUCTOR DEVICES TRANSPORTING USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	[Problem] To provide: a layered body wherein a sheet surface has slight adhesiveness, enabling easy temporary securing of a semiconductor chip, or the like, that has been diced, onto a semiconductor substrate, and wherein permanent adhesion to an adhered object is expressed through post-curing; a layered body that includes the same; a semiconductor device that uses the same; and a method for manufacturing the semiconductor device.[Means for Solving the Problem] A silicone-based adhesive sheet wherein, prior to heating, the delamination mode of the adhesive surface from a non-adhesive substrate is interfacial delamination, and after heating of the adhesive surface in a range of between 50 and 200°C, the delamination mode of the adhesive surface from another non-adhesive substrate changes to cohesive fracturing, and exhibits permanent adhesion; the use thereof in a die attached film for a semiconductor, or the like; and a semiconductor device, such as an MEMS device, or the like, that has a structure wherein a semiconductor chip or a wafer for semiconductors is secured onto a substrate through a cured material of the silicone-based adhesive sheet.