RESIN COMPOSITION FOR A METAL SUBSTRATE, AND RESIN VARNISH AND METAL BASE COPPER-CLAD LAMINATE COMPRISING THE SAME

The present disclosure provides a resin composition for a metal substrate, and a resin varnish and a metal base copper-clad laminate comprising the same. The resin composition comprises 5-40% of a main resin and 60-95% of a thermally conductive filler when the total weight of the resin composition i...

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Bibliographische Detailangaben
Hauptverfasser: HUANG, Zengbiao, SHE, Naidong
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:The present disclosure provides a resin composition for a metal substrate, and a resin varnish and a metal base copper-clad laminate comprising the same. The resin composition comprises 5-40% of a main resin and 60-95% of a thermally conductive filler when the total weight of the resin composition is calculated as 100%, wherein the main resin comprises 60-90% of a flexible epoxy resin having a structure as shown in Formula I and 10-40% of a phenoxy resin when the total weight of the main resin is calculated as 100%. The resin composition provided by the present disclosure has a low modulus, can alleviate the stress generated by thermal shocks and can withstand more than 1000 thermal cycles.