CURABLE RESIN COMPOSITION, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

A curable resin composition for non-pressurized type case mold sealing, which is solid at 25°C and which has a gelation time at 110°C of 10 min or more.

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Bibliographische Detailangaben
Hauptverfasser:	ONO, Yuta, MURASUGI, Narutoshi, TOGAWA, Mitsuo, ARATA, Michitoshi
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	A curable resin composition for non-pressurized type case mold sealing, which is solid at 25°C and which has a gelation time at 110°C of 10 min or more.