CONNECTION TERMINAL UNIT

A connection terminal unit that can be appropriately connected to terminal connection portions of a semiconductor module including a semiconductor element and that can reduce a projection area when seen in a direction orthogonal to a direction along a chip surface is realized. The connection termina...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	HOTTA, Yutaka, OSUKA, Shinya, KUME, Yasuhiro
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONTROL OR REGULATION THEREOF CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER CONVERSION OR DISTRIBUTION OF ELECTRIC POWER CURRENT COLLECTORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERATION LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	A connection terminal unit that can be appropriately connected to terminal connection portions of a semiconductor module including a semiconductor element and that can reduce a projection area when seen in a direction orthogonal to a direction along a chip surface is realized. The connection terminal unit (1) includes a plurality of connection terminals (25) facing and connected to a plurality of terminal connection portions (55) of a semiconductor module (5), and a terminal mold portion (20) holding the connection terminals (25). The terminal mold portion (20) has an abutment portion (T) that abuts against the semiconductor module (5) or a base material (B) holding the semiconductor module (5). The abutment portion (T) has a vertical abutment portion (1a) that abuts against the semiconductor module or the base material (B) from a vertical direction (V) that is a direction in which the connection terminals (25) face the terminal connection portions (55), and a side abutment portion (1b, 1c) that abuts against the semiconductor module or the base material (B) from at least two directions that are different from each other and intersect with the vertical direction (V).