POWER AMPLIFIER PACKAGES AND SYSTEMS INCORPORATING DESIGN-FLEXIBLE PACKAGE PLATFORMS

Embodiments of Doherty Power Amplifier (PA) and other PA packages are provided, as are systems including PA packages. In embodiments, the PA package includes a package body (112) having a longitudinal axis (114), a first group of input-side leads (132-1, 134-1, 136-1) projecting from a first side (1...

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Bibliographische Detailangaben
Hauptverfasser: DOUGHERTY, David, NANAN, Jean-Christophe, VISWANATHAN, Lakshminarayan, MAARSHALL, Scott, HUE, Xavier
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:Embodiments of Doherty Power Amplifier (PA) and other PA packages are provided, as are systems including PA packages. In embodiments, the PA package includes a package body (112) having a longitudinal axis (114), a first group of input-side leads (132-1, 134-1, 136-1) projecting from a first side (115) of the package body (112) and having an intra-group lead spacing, and a first group of output-side leads (132-2, 134-2, 136-2) projecting from a second side (117) of the package body (112) and also having the intra-group lead spacing. A first carrier input lead (130-1) projects from the first package body (112) side and is spaced from the first group of input-side leads (132-1, 134-1, 136-1) by an input-side isolation gap (137-1), which has a width exceeding the intra-group lead spacing. Similarly, a first carrier output lead (130-2) projects from the second package body (112) side, is laterally aligned with the first carrier input lead (130-1), and is separated from the first group of output-side leads (132-2, 134-2, 136-2) by an output-side isolation gap (137-2).