SYSTEM AND METHOD FOR MULTI-POINT THERMAL PATH ASSESSMENT

A method (700) for assessing a thermal path associated with an integrated circuit (102, 202, 302, 402) includes identifying a heat application mode based on a design type of the integrated circuit (102, 202, 302, 402). The method (700) also includes measuring (706) a first temperature of at least on...

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Bibliographische Detailangaben
Hauptverfasser:	ROUTH, Soumyajit, FRANCISCO, Gregg N, PRITCHETT, Thomas E, YEO, Kok Wee, GLENN, Jack L, GERTISER, Kevin M, MANE, Narendra J
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS PRINTED CIRCUITS TESTING TESTING STATIC OR DYNAMIC BALANCE OF MACHINES ORSTRUCTURES TESTING STRUCTURES OR APPARATUS NOT OTHERWISE PROVIDED FOR
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Beschreibung
Zusammenfassung:	A method (700) for assessing a thermal path associated with an integrated circuit (102, 202, 302, 402) includes identifying a heat application mode based on a design type of the integrated circuit (102, 202, 302, 402). The method (700) also includes measuring (706) a first temperature of at least one thermal sensing device (106, 206, 306, 406) associated with the integrated circuit (102, 202, 302, 402). The method (700) also includes applying heat (708) to at least a portion of the integrated circuit (102, 202, 302, 402) according to the heat application mode. The method (700) also includes measuring a second temperature (710) of the at least one thermal sensing device (106, 206, 306, 406). The method (700) also includes determining (712) a difference between the first temperature and the second temperature. The method (700) also includes determining (712) whether a thermal path between the integrated circuit (102, 202, 302, 402) and an associated substrate is sufficient based on a comparison (714) of the difference between the first temperature and the second temperature with a predetermined difference between an initial temperature and a subsequent temperature of the at least one thermal sensing device (106, 206, 306, 406).