MOUNTING DEVICES FOR SEMICONDUCTOR PACKAGES

Mounting device (10) for semiconductor packages (11), the device (10) comprising a bottom side (14) comprising one or more cavities (15) to house semiconductor packages (11), a top side (13) comprising a plurality of holes (13a) extending from the bottom side (14) to the top side (13) for accommodat...

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Bibliographische Detailangaben
Hauptverfasser:	GONZÁLEZ ESPIN, Francisco, CASTILLO, Jose, Antonio, HALLBERG, Torbjorn
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	Mounting device (10) for semiconductor packages (11), the device (10) comprising a bottom side (14) comprising one or more cavities (15) to house semiconductor packages (11), a top side (13) comprising a plurality of holes (13a) extending from the bottom side (14) to the top side (13) for accommodating contact pins (12) of the semiconductor package (11) and fixation means to fix the device (10) housing the semiconductor packages (11) to a heat dissipation structure.