PRESSURE SENSOR DIE ATTACH

A pressure sensor system package or substrate (100) has a trench (110). A first material which may be an adhesive (400) partially fills the trench (110) and is cured. A second material (500) is added over the first material (400). While the second material which may be an adhesive (500) is still liq...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Wagner, Chris, Van Sprakelaar, Gertjan, Razavidinani, Keyanoush
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	MEASURING MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE PHYSICS TESTING
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	A pressure sensor system package or substrate (100) has a trench (110). A first material which may be an adhesive (400) partially fills the trench (110) and is cured. A second material (500) is added over the first material (400). While the second material which may be an adhesive (500) is still liquid, a pressure sensor die (200) is placed in the trench such that a bottom (224) of a frame (220) of the pressure sensor die (200) rests on top of the first material (400). The second material (500) is then cured to fix the pressure sensor die (200) in place.