RESIN COMPOSITION

An object of the present invention is to provide a resin composition that is curable at low temperatures around room temperature in a relatively short time (within several hours), and is not prone to produce contamination on the surroundings caused by resin volatilization, and that is suitable as a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	ARAI Fuminori, IWAYA Kazuki
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON CORRECTING FLUIDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILLING PASTES INKS MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	An object of the present invention is to provide a resin composition that is curable at low temperatures around room temperature in a relatively short time (within several hours), and is not prone to produce contamination on the surroundings caused by resin volatilization, and that is suitable as a one-part adhesive for use in the manufacture of an image sensor module or an electronic component.The resin composition of the present invention contains a 2-methylene-1,3-dicarbonyl compound and an initiator. The 2-methylene-1,3-dicarbonyl compound has a molecular weight of 180 to 10,000, and the initiator contains a basic substance having a pKaof 8 or greater. Further, the 2-methylene-1,3-dicarbonyl compound is a compound containing a structural unit represented by formula (I) below.