METAL MATERIAL AND METHOD FOR PRODUCING SAME

[Problem] Provided are a metal material including a passive film on a surface and having corrosion resistance while having a small contact resistance, and a method for producing the metal material. Examples of the metal material include a material that is preferable as a material of a separator and...

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Bibliographische Detailangaben
Hauptverfasser:	KAWASAKA Kenji, SHIN Yoshio, FUKUDOME Yoshihisa, KURAHASHI Ryurou, KAKUDOU Shigeo
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	[Problem] Provided are a metal material including a passive film on a surface and having corrosion resistance while having a small contact resistance, and a method for producing the metal material. Examples of the metal material include a material that is preferable as a material of a separator and a current collector plate in a fuel cell. [Solution] Conductive particles 3 are embedded in and caused to adhere to a metal substrate 1 including, on a surface thereof, a passive film 2, in a state where the conductive particles 3 penetrate the passive film 2 in a thickness direction, and the surface of the metal substrate is covered with a coating film having conductivity and corrosion resistance. To cause the conductive particles to adhere in such a manner, the conductive particles 3 may be scattered on the metal substrate 1 on which the passive film 2 is formed, and the conductive particles 3 may be pushed into the surface of the metal substrate 1 by pressing with a roll or the like.