PHOTOSENSITIVE RESIN COMPOSITION, AND METHOD FOR ETCHING GLASS SUBSTRATE

To provide a photosensitive resin composition capable of forming an etching mask having sufficient resistance to an etchant to be used for etching of a glass substrate, the mask being able to be peeled off by an organic solvent-based stripping liquid, and a method for etching a glass substrate, the...

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Bibliographische Detailangaben
1. Verfasser:	UEMATSU, Teruhiro
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR AUXILIARY PROCESSES IN PHOTOGRAPHY BASIC ELECTRIC ELEMENTS CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR,STEREO-PHOTOGRAPHIC PROCESSES PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES PHYSICS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	To provide a photosensitive resin composition capable of forming an etching mask having sufficient resistance to an etchant to be used for etching of a glass substrate, the mask being able to be peeled off by an organic solvent-based stripping liquid, and a method for etching a glass substrate, the method including forming an etching mask using the photosensitive resin composition. For formation of an etching mask at the time of etching a glass substrate, a photosensitive resin composition including a resin component (A) having an acid-dissociable dissolution-inhibiting group and whose solubility in alkali is increased by action of an acid, an acid generator (B) generating an acid by irradiation with radiation, a filler (C), and a plasticizer (D), or a photosensitive resin composition including a resin component (A1) having a phenolic hydroxyl group, a protective agent (A2) to give an acid-dissociable dissolution-inhibiting group by reacting with a phenolic hydroxyl group, the acid generator (B), the filler (C), and the plasticizer (D), is used.