FOLDABLE ELECTRONIC DEVICE MODULES WITH IMPACT AND BEND RESISTANCE

A foldable electronic device module includes: a glass-containing cover element having a thickness from about (25) μm to about (200) μm, an elastic modulus from about (20) to (140) GPa, and first and second primary surfaces; a stack comprising: (a) an interlayer having an elastic modulus from about (...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	QAROUSH, Yousef Kayed, BABY, Shinu, ZHANG, Bin, JOSHI, Dhananjay
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CALCULATING COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRICITY PHYSICS
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