FOLDABLE ELECTRONIC DEVICE MODULES WITH IMPACT AND BEND RESISTANCE

FOLDABLE ELECTRONIC DEVICE MODULES WITH IMPACT AND BEND RESISTANCE

A foldable electronic device module includes: a glass-containing cover element having a thickness from about (25) μm to about (200) μm, an elastic modulus from about (20) to (140) GPa, and first and second primary surfaces; a stack comprising: (a) an interlayer having an elastic modulus from about (...

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Bibliographische Detailangaben
Hauptverfasser: QAROUSH, Yousef Kayed, BABY, Shinu, ZHANG, Bin, JOSHI, Dhananjay
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
ELECTRICITY
PHYSICS
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Beschreibung
Zusammenfassung:A foldable electronic device module includes: a glass-containing cover element having a thickness from about (25) μm to about (200) μm, an elastic modulus from about (20) to (140) GPa, and first and second primary surfaces; a stack comprising: (a) an interlayer having an elastic modulus from about (0.01) to (10) GPa and a thickness from about 50 to (200) μm, and (b) a flexible substrate having a thickness from about (100) to (200) μm; and a first adhesive joining the stack to the cover element, and comprising an elastic modulus from about (0.001) to (10) GPa and a thickness from about (5) to (25) μm. Further, the module comprises an impact resistance characterized by tensile stresses of less than about (4100) MPa and less than about (8300) MPa at the first and second primary surfaces of the cover element, respectively, upon an impact in a Pen Drop Test.