AMPLIFIERS AND AMPLIFIER MODULES HAVING STUB CIRCUITS
An amplifier module (100) is provided. The amplifier module includes a multi-layer printed circuit board (PCB). A first power transistor die (142) is mounted at a top surface of the multi-layer PCB. A second power transistor die (132) is mounted at the top surface of the multi-layer PCB. An impedanc...
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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Zusammenfassung: | An amplifier module (100) is provided. The amplifier module includes a multi-layer printed circuit board (PCB). A first power transistor die (142) is mounted at a top surface of the multi-layer PCB. A second power transistor die (132) is mounted at the top surface of the multi-layer PCB. An impedance inversion element (152) is coupled between an output (146) of the first power transistor die and an output (136) of the second power transistor die. A combining node (150) is formed at the output of the second power transistor die. A stub circuit (154,156) including a transmission line element is coupled at the combining node. |
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