THROUGH ELECTRODE SUBSTRATE
The present invention relates to a through-hole electrode substrate comprising:a substrate including a through-hole extending from a first aperture of a first surface to a second aperture of a second surface, an area of the second aperture being larger than an area of the first aperture, the through...
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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Zusammenfassung: | The present invention relates to a through-hole electrode substrate comprising:a substrate including a through-hole extending from a first aperture of a first surface to a second aperture of a second surface, an area of the second aperture being larger than an area of the first aperture, the through-hole having a minimum aperture part on the first surface, an area of the minimum aperture part being the smallest among a plurality of areas of the through-hole in a planar view;a first member arranged within the through-hole; andan insulating resin layer contacting the first member exposed to one of the first surface and the second surface,wherein the insulating resin layer has a gas discharge function. |
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