VINYL THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE, AND PRINTED CIRCUIT BOARD

Provided is a vinyl thermosetting resin composition, a prepreg, a laminate, and a printed circuit board. The vinyl thermosetting resin composition comprises: a vinyl thermosetting resin; a curing agent; and hollow borosilicate microspheres with surfaces chemically modified by a vinyl polyphenylene e...

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Bibliographische Detailangaben
Hauptverfasser:	LIU, Qianfa, YAN, Shanyin, ZENG, Xianping, DU, Cuiming, CHEN, Guangbin
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES PREPARATION OF CARBON BLACK THEIR PREPARATION OR CHEMICAL WORKING-UP TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS,TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES
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Beschreibung
Zusammenfassung:	Provided is a vinyl thermosetting resin composition, a prepreg, a laminate, and a printed circuit board. The vinyl thermosetting resin composition comprises: a vinyl thermosetting resin; a curing agent; and hollow borosilicate microspheres with surfaces chemically modified by a vinyl polyphenylene ether resin. The laminate produced not only has excellent overall properties such as low dielectric constant, low dielectric loss, low water absorption rate, good heat resistance, and the like, but also has small fluctuations in dielectric constants between batches, which can satisfy the requirements for dielectric constant stability and/or thickness consistency of the substrate by customers.