POLYMERIC FOAM LAYER AND METHODS OF MAKING THE SAME

Polymeric foam layer comprising a star polymer, wherein the polymeric foam layer has a thickness up to 25,700 micrometers, and methods of making the same. Exemplary uses of polymeric foam layers described herein including a finishing pad for silicon wafers and vibration damping.

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Bibliographische Detailangaben
Hauptverfasser:	KALISH, Jeffrey P, MEREE, Caitlin E
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY COMPOSITIONS BASED THEREON GENERAL PROCESSES OF COMPOUNDING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL WORKING-UP
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Beschreibung
Zusammenfassung:	Polymeric foam layer comprising a star polymer, wherein the polymeric foam layer has a thickness up to 25,700 micrometers, and methods of making the same. Exemplary uses of polymeric foam layers described herein including a finishing pad for silicon wafers and vibration damping.