HIGH DENSITY OPTO-ELECTRONIC INTERCONNECTION CONFIGURATION UTILIZING PASSIVE ALIGNMENT

HIGH DENSITY OPTO-ELECTRONIC INTERCONNECTION CONFIGURATION UTILIZING PASSIVE ALIGNMENT

A high density interconnect arrangement takes the form of a backplane-pluggable card, with electrical connections formed along a single (pluggable) edge and all remaining connections provided via optical fibers. An exemplary interconnect arrangement also includes on-board optical sources and silicon...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: LEONHARTSBERGER, Alan, DAMA, Bipin, SHASTRI, Kalpendu, PATHAK, Soham, YELAMARTY, Rao, SHASTRI, Anujit
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A high density interconnect arrangement takes the form of a backplane-pluggable card, with electrical connections formed along a single (pluggable) edge and all remaining connections provided via optical fibers. An exemplary interconnect arrangement also includes on-board optical sources and silicon photonic-based circuitry for providing optical transceiver functionality. Passively aligned fiber arrays are utilized to provide I/O connections to external elements, as well as between laser sources and on-board silicon photonics.