INDUCTION HEATING DEVICE HAVING IMPROVED COOLING STRUCTURE

The present disclosure relates to an induction heating device with an improved cooling structure. An induction heating device includes a casing; a first induction heating module disposed within the casing; a first heat sink disposed below the first induction heating module to dissipate heat from the...

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Bibliographische Detailangaben
Hauptverfasser: LIM, Hakjoo, YANG, Jaekyung, LEE, Yongsoo, SIM, Hoon Seob, LEE, Se Mi
Format: Patent
Sprache:eng ; fre ; ger
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