INDUCTION HEATING DEVICE HAVING IMPROVED COOLING STRUCTURE

The present disclosure relates to an induction heating device with an improved cooling structure. An induction heating device includes a casing; a first induction heating module disposed within the casing; a first heat sink disposed below the first induction heating module to dissipate heat from the...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LIM, Hakjoo, YANG, Jaekyung, LEE, Yongsoo, SIM, Hoon Seob, LEE, Se Mi
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:The present disclosure relates to an induction heating device with an improved cooling structure. An induction heating device includes a casing; a first induction heating module disposed within the casing; a first heat sink disposed below the first induction heating module to dissipate heat from the first induction heating module; a first heat pipe passing through the first heat sink and extending out of the first induction heating module to discharge the heat dissipated from the first heat sink out of the first induction heating module; an air-discharge fan disposed at one end of an inner edge of the casing to discharge air inside the casing out of the casing; and a cooling fan disposed at another end of the inner edge of the casing to blow air to the air-discharge fan, wherein the first end is opposite to the second end, wherein one end of the first heat pipe protruding out of the first induction heating module is disposed on an air-flow path between the cooling fan and the air-discharge fan.