SENSOR PACKAGE, SENSOR ASSEMBLY, AND METHOD OF FABRICATION

A sensor package (20) includes a sensor die (22), connector pins (32, 34) connected to the sensor die, and a housing (42) in which the sensor die is located. The housing has first and second surfaces (44, 46) spaced apart from one another by first, second, third, and fourth sidewalls (48, 50, 52, 54...

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Bibliographische Detailangaben
1. Verfasser:	OFFERMANN, Bernd
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	A sensor package (20) includes a sensor die (22), connector pins (32, 34) connected to the sensor die, and a housing (42) in which the sensor die is located. The housing has first and second surfaces (44, 46) spaced apart from one another by first, second, third, and fourth sidewalls (48, 50, 52, 54). The connector pins extend from the first sidewall, and the housing includes a notch region (56) extending into the first surface of the housing such that a material portion of the housing is absent at the first sidewall and at the first surface of the housing. A method (90) for forming a sensor assembly (60) includes retaining (98) the sensor package in a cavity (106) of a mold tool (104) by receiving an alignment bar (84) of an alignment tool (80) in the notch region and performing (110, 116) an overmolding process to fill the cavity with an overmold material (70). The alignment bar is configured to hold the sensor package in the mold tool during overmolding.