METAL LAYERING CONSTRUCTION IN FLEX/RIGID-FLEX PRINTED CIRCUITS

METAL LAYERING CONSTRUCTION IN FLEX/RIGID-FLEX PRINTED CIRCUITS

A printed circuit board is provided. The printed circuit board includes a flexible region. The flexible region includes a first copper layer, a first dielectric layer, a second copper layer, an adhesive layer, and a first metal layer, in the order listed. The first metal layer includes a metal film...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LESTER, Jonathan Bernard, GRAYDON, Bhret Robert, MICKELSON, Matthew David, RYAN, Lauren Akemi Hamamoto Donegan
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:A printed circuit board is provided. The printed circuit board includes a flexible region. The flexible region includes a first copper layer, a first dielectric layer, a second copper layer, an adhesive layer, and a first metal layer, in the order listed. The first metal layer includes a metal film having a tensile strength greater than the first and second copper layers and greater than the dielectric layer.