ELECTROLESS NICKEL PLATING SOLUTION

An electroless nickel plating solution, includinga source of nickel ions,a source of molybdenum ions,a source of tungsten ions,a source of hypophosphite ionsat least one complexing agent,at least one organic sulphur containing compound in a concentration of 0.38-38.00 μmol/L, andat least one amino a...

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Bibliographische Detailangaben
Hauptverfasser:	Schulze Andreas, BERA, Holger, SCHWARZ, Christian
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ALLOYS BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Beschreibung
Zusammenfassung:	An electroless nickel plating solution, includinga source of nickel ions,a source of molybdenum ions,a source of tungsten ions,a source of hypophosphite ionsat least one complexing agent,at least one organic sulphur containing compound in a concentration of 0.38-38.00 μmol/L, andat least one amino acid in a concentration of 0.67-40.13 mmol/L, anda method for electroless plating of a nickel alloy layer on a substrate, a nickel alloy layer, andan article comprising the a nickel alloy layer.