HEAT DISSIPATION ASSEMBLY

A heat dissipation assembly includes a case and a partition structure. The case has a chamber. The partition structure includes a partition wall vertically disposed in the chamber to separate a first flow path and a second flow path in the chamber, and the partition wall has a breach and a valve str...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	MAO, Tai-Chuan, HUANG, Shun-Chih, LIN, Yi-Jhen
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT HEATING LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PRINTED CIRCUITS SEMICONDUCTOR DEVICES WEAPONS
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Beschreibung
Zusammenfassung:	A heat dissipation assembly includes a case and a partition structure. The case has a chamber. The partition structure includes a partition wall vertically disposed in the chamber to separate a first flow path and a second flow path in the chamber, and the partition wall has a breach and a valve structure disposed at the breach, wherein the valve structure covers the breach when the valve structure is not pushed open. When a fluid pressure existed in a section of one of the first flow path and the second flow path which is adjacent to the valve structure is greater than a fluid pressure existed in a section of the other one of the first flow path and the second flow path which is adjacent to the valve structure, the valve structure is pushed away to expose at least a part of the breach.