ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

This electronic device is provided with: a resin molding (10); and a conductive cable (31b) including an electric wire (32b). One end portion (35b) of the conductive cable (31b) is embedded in the resin molding (10). The surface of the resin molding (10) exposes an end surface (34b) on the side of t...

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Bibliographische Detailangaben
1. Verfasser:	KAWAI, Wakahiro
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	This electronic device is provided with: a resin molding (10); and a conductive cable (31b) including an electric wire (32b). One end portion (35b) of the conductive cable (31b) is embedded in the resin molding (10). The surface of the resin molding (10) exposes an end surface (34b) on the side of the one end portion (35b) of the conductive cable (31b) and includes a surface (11) which is continuous to the end surface (34b). The electronic device is further provided with wirings (40f, 40i) formed on the end surface (34b) and the surface (11) so as to be connected to the electric wire (32b) in the end surface (34b).