POWER MODULE

A power module 1 comprises a base plate 2, a ceramic insulating substrate 4 bonded on the base plate 2, and a semiconductor element 6 bonded on the ceramic insulating substrate 4, wherein a surface 2b of the base plate 2 on a side opposite to the ceramic insulating substrate 4 has a warp 2c with a c...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	HIROTSURU, Hideki, SAKAI, Atsushi, TANIGUCHI, Yoshitaka, ICHIKAWA, Kohki
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS BASIC ELECTRIC ELEMENTS CONTROL OR REGULATION THEREOF CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERATION SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A power module 1 comprises a base plate 2, a ceramic insulating substrate 4 bonded on the base plate 2, and a semiconductor element 6 bonded on the ceramic insulating substrate 4, wherein a surface 2b of the base plate 2 on a side opposite to the ceramic insulating substrate 4 has a warp 2c with a convex shape, and a linear thermal expansion coefficient α1 (× 10-6/K) of the base plate 2 and a linear thermal expansion coefficient α2 (× 10-6/K) of the ceramic insulating substrate 4 when a temperature decreases in the range of 25°C to 150°C satisfy the following Expression (1).α1−α2α1+α2/2×100≤10