SEMICONDUCTOR PACKAGE HAVING A LASER-ACTIVATABLE MOLD COMPOUND
Embodiments of molded packages and corresponding methods of manufacture are provided. In an embodiment of a molded package, the molded package includes a laser-activatable mold compound (102) having a plurality of laser-activated regions which are plated with an electrically conductive material to f...
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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Zusammenfassung: | Embodiments of molded packages and corresponding methods of manufacture are provided. In an embodiment of a molded package, the molded package includes a laser-activatable mold compound (102) having a plurality of laser-activated regions which are plated with an electrically conductive material to form metal pads (106) and/or metal traces (107) at a first side of the laser-activatable mold compound. A semiconductor die (108) embedded in the laser-activatable mold compound has a plurality of die pads (110). An interconnect (112) electrically connects the plurality of die pads of the semiconductor die to the metal pads and/or metal traces at the first side of the laser-activatable mold compound. |
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