ELECTRONICS PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE AND METHOD OF MANUFACTURING THEREOF

ELECTRONICS PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE AND METHOD OF MANUFACTURING THEREOF

An electronics package includes an insulating substrate, an electrical component having a back surface coupled to a first surface of the insulating substrate, and an insulating structure surrounding at least a portion of a perimeter of the electrical component. A first wiring layer extends from the...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KAPUSTA, Christopher James, TUOMINEN, Risto, Ilkka Sakari, FILLION, Raymond Albert, NAGARKAR, Kaustubh, Ravindra
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An electronics package includes an insulating substrate, an electrical component having a back surface coupled to a first surface of the insulating substrate, and an insulating structure surrounding at least a portion of a perimeter of the electrical component. A first wiring layer extends from the first surface of the insulating substrate and over a sloped side surface of the insulating structure to electrically couple with at least one contact pad on an active surface of the electrical component. A second wiring layer is formed on a second surface of the insulating substrate and extends through at least one via therein to electrically couple with the first wiring layer.