FILM CUTTING DEVICE HAVING A LINEAR ACTUATOR

A method for cutting a film of material and a cutting device for cutting the film of material are described herein. The cutting device includes a film support plate, and a pressure plate configured to move relative to the film support plate to hold the film of material on the film support plate. The...

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Bibliographische Detailangaben
Hauptverfasser: MCCARTY II, Donald, L, LUND, John, OCONNELL, Paul, ZIEMAN, Jonathan, J, GEE, William, E, DOTSON, Larry
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:A method for cutting a film of material and a cutting device for cutting the film of material are described herein. The cutting device includes a film support plate, and a pressure plate configured to move relative to the film support plate to hold the film of material on the film support plate. The device further includes one or more blades, and a linear actuator configured to move the one or more blades relative to the film support plate to cut the film of material held on the film support plate.