COOKWARE WITH COPPER BONDED LAYER

Provided is an article of cookware and a method of making the same. The cookware has at least one stainless steel layer and at least one copper layer metallurgically bonded directly to the at least one stainless steel layer via solid state bonding. The at least one stainless steel layer may be a fer...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	GROLL, William, A, PERRY, Bruce, W
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	APPARATUS FOR MAKING BEVERAGES COFFEE MILLS DOMESTIC ARTICLES OR APPLIANCES FURNITURE HUMAN NECESSITIES KITCHEN EQUIPMENT LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS SPICE MILLS SUCTION CLEANERS IN GENERAL TRANSPORTING
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Beschreibung
Zusammenfassung:	Provided is an article of cookware and a method of making the same. The cookware has at least one stainless steel layer and at least one copper layer metallurgically bonded directly to the at least one stainless steel layer via solid state bonding. The at least one stainless steel layer may be a ferritic stainless steel layer, and the at least one copper layer may be a grain stabilized copper. The at least one stainless steel layer may be made from a 400 series stainless steel, such as a 436 stainless steel alloy, a 439 stainless steel alloy, or a 444 stainless steel alloy. The at least one copper layer may be made from a high purity, oxygen free copper alloy, such as a C101 copper alloy, a C102 copper alloy, or a C107 copper alloy.