METHOD OF MANUFACTURING A COMPONENT CARRIER USING A SEPARATION COMPONENT AND A SEMI-FINISHED PRODUCT

A component carrier (100a) comprising: a layer stack (101) comprising electrically conductive layer structures (104) and electrically insulating layer structures (102), wherein at least one electrically insulating layer structure (130) is a low Young modulus layer structure (130) formed of a low Young modulus material, in particular with a Young modulus of less than 10 GPa, and wherein the layer stack (101) is at least partially formed as a redistribution structure (160); an electronic component (115) embedded in a cavity (111) of the layer stack (101) and electrically connected with the redistribution structure (160) such that a first electric contact (116) of the electronic component (115) is transferred via the redistribution structure (160) to a second electric contact (162) at a main surface (165) of the layer stack (101), wherein the second electric contact (162) is larger than the first electric contact (116); and wherein the electronic component (115) is arranged between, in particular directly between, the low Young modulus layer structure (130) and the redistribution structure (160).