PROTECTIVE FILM FOR AN ELECTRONIC DEVICE AND METHOD FOR ATTACHING THE PROTECTION FILM

A protective film for an electronic device includes a protective base film (PBF) having a first modulus (MD1) of 1,000 MPa or less at a first temperature (TM1) and a second modulus (MD2) of 15 MPa or more at a second temperature (TM2) about 80 °C higher than the first temperature (TM1). Further, an...

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Bibliographische Detailangaben
Hauptverfasser:	Kim, Boa, Kim, Kyungtae, Oh, Hyunjoon, Shin, Heonjung
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CALCULATING COMPUTING COUNTING ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC DIGITAL DATA PROCESSING ELECTRICITY INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES PERFORMING OPERATIONS PHYSICS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TELEPHONIC COMMUNICATION TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	A protective film for an electronic device includes a protective base film (PBF) having a first modulus (MD1) of 1,000 MPa or less at a first temperature (TM1) and a second modulus (MD2) of 15 MPa or more at a second temperature (TM2) about 80 °C higher than the first temperature (TM1). Further, an electronic device (ED) includes a flexible display module (DM), a window (WD) on the flexible display module (DM), and a protective film (PF) on the window (WD).