PLATABILITY IMPROVER, MOLDED OBJECT FOR PLATING, PELLET COMPOSITION FOR PLATING, PLATED MOLDED OBJECT, AND PLATING METHOD

The platability improver of the present invention comprises heterophasic-polymer particles having a coefficient of variation in particle diameter of 40%-90%. It is preferable that the proportion of polymer particles each having a particle diameter of 0.05 µm or larger be 80% by volume or more with r...

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Bibliographische Detailangaben
Hauptverfasser:	IMOTO Yuka, KITAGUCHI Hironori, WATANABE Atsushi, OONO Noriyoshi
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	The platability improver of the present invention comprises heterophasic-polymer particles having a coefficient of variation in particle diameter of 40%-90%. It is preferable that the proportion of polymer particles each having a particle diameter of 0.05 µm or larger be 80% by volume or more with respect to all the heterophasic-polymer particles and the proportion of polymer particles each having a particle diameter of 0.05 µm or larger but smaller than 0.15 µm be 10%-60% by volume with respect to all the heterophasic-polymer particles.