METHOD FOR PRODUCING A VIA IN A CARRIER LAYER PRODUCED FROM A CERAMIC AND CARRIER LAYER HAVING A VIA

METHOD FOR PRODUCING A VIA IN A CARRIER LAYER PRODUCED FROM A CERAMIC AND CARRIER LAYER HAVING A VIA

A method for making a via (3) in a carrier layer (1) made of a ceramic comprising:providing the carrier layer (1),realizing a passage recess (2) in the carrier layer (1),at least partially filling the passage recess (2) with a paste (3), andperforming a bonding process, in particular an active solde...

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Bibliographische Detailangaben
Hauptverfasser: BRITTING, Stefan, REGER, Martin, HERRMANN, Rainer, MEYER, Andreas, SCHMIDT, Karsten
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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Beschreibung
Zusammenfassung:A method for making a via (3) in a carrier layer (1) made of a ceramic comprising:providing the carrier layer (1),realizing a passage recess (2) in the carrier layer (1),at least partially filling the passage recess (2) with a paste (3), andperforming a bonding process, in particular an active soldering process or a DCB process, for bonding a metallization (5) to the carrier layer (1), the via (3′) being realized from the paste (3) in the passage recess (2) when the bonding process is performed.