CONDUCTIVE PASTE

Provided is a conductive paste which makes it possible to form a conductive layer having excellent conductivity even when spherical copper powder having a small particle diameter is used. Disclosed is a conductive paste containing a conductive filler and a binder resin. In this conductive paste, when a first coating film is prepared by coating a first paste containing 100 parts by weight of the binder resin and 20 parts by weight of the conductive filler on a first substrate at a coating amount of 100 g/m2and drying and curing the binder resin, the first coating film has a light transmittance of 20% or more, and when a second coating film is prepared by coating a second paste containing the binder resin but not containing the conductive filler on a second substrate at a coating amount equivalent to a dry solid content of 55 g/m2and drying and curing the binder resin, a film thickness t µm of the second coating film and a shrinkage ratio α% obtained by the following formula (1) satisfy a relationship of the following formula (2):α=1−arclengthofasurfaceofsecondcoatingfilmafterdryingandcuring/arclengthofasecondsubstrateafterdryingandcuring×100andα≥5t+50×10−3