ELECTRONIC MODULE AND METHOD FOR PRODUCING AN ELECTRONIC MODULE
The invention relates to an electronic module (1), which comprises a substrate printed circuit board (2) composed of an insulating material having a first surface (21), a second surface (22) facing away therefrom and a circumferential side face (23) and furthermore metallization areas (24) arranged...
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| creator | KAESS, Udo BAUER, Klaus |
| description | The invention relates to an electronic module (1), which comprises a substrate printed circuit board (2) composed of an insulating material having a first surface (21), a second surface (22) facing away therefrom and a circumferential side face (23) and furthermore metallization areas (24) arranged on the first surface (21) of the substrate printed circuit board (2), electronic components (31, 32), which are electrically contact-connected to the metallization areas (24) on the first surface (21), connection contact faces (26) arranged on the second surface (22) of the substrate printed circuit board (2) and a mould compound (4) arranged over the electronic components (31, 32) on the first surface (21), which mould compound completely covers the first surface (21) over the components (31, 32) up to the circumferential side face (23). It is proposed that a circumferetnial edge region (25), which directly adjoins the circumferential side face (23), on the first surface (21) of the substrate printed circuit board (2) is free of metallization areas (24) and the mould compound (4) in this circumferential edge region (25) is in direct contact with the insulating material of the substrate printed circuit board (2). The invention further relates to a method for producing such an electronic module. |
| format | Patent |
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It is proposed that a circumferetnial edge region (25), which directly adjoins the circumferential side face (23), on the first surface (21) of the substrate printed circuit board (2) is free of metallization areas (24) and the mould compound (4) in this circumferential edge region (25) is in direct contact with the insulating material of the substrate printed circuit board (2). The invention further relates to a method for producing such an electronic module.</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200506&DB=EPODOC&CC=EP&NR=3646678A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200506&DB=EPODOC&CC=EP&NR=3646678A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KAESS, Udo</creatorcontrib><creatorcontrib>BAUER, Klaus</creatorcontrib><title>ELECTRONIC MODULE AND METHOD FOR PRODUCING AN ELECTRONIC MODULE</title><description>The invention relates to an electronic module (1), which comprises a substrate printed circuit board (2) composed of an insulating material having a first surface (21), a second surface (22) facing away therefrom and a circumferential side face (23) and furthermore metallization areas (24) arranged on the first surface (21) of the substrate printed circuit board (2), electronic components (31, 32), which are electrically contact-connected to the metallization areas (24) on the first surface (21), connection contact faces (26) arranged on the second surface (22) of the substrate printed circuit board (2) and a mould compound (4) arranged over the electronic components (31, 32) on the first surface (21), which mould compound completely covers the first surface (21) over the components (31, 32) up to the circumferential side face (23). It is proposed that a circumferetnial edge region (25), which directly adjoins the circumferential side face (23), on the first surface (21) of the substrate printed circuit board (2) is free of metallization areas (24) and the mould compound (4) in this circumferential edge region (25) is in direct contact with the insulating material of the substrate printed circuit board (2). The invention further relates to a method for producing such an electronic module.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLB39XF1Dgny9_N0VvD1dwn1cVVw9HNR8HUN8fB3UXDzD1IICAIKO3v6uQMlFDBU8zCwpiXmFKfyQmluBgU31xBnD93Ugvz41OKCxOTUvNSSeNcAYzMTMzNzC0dDYyKUAAAgzynv</recordid><startdate>20200506</startdate><enddate>20200506</enddate><creator>KAESS, Udo</creator><creator>BAUER, Klaus</creator><scope>EVB</scope></search><sort><creationdate>20200506</creationdate><title>ELECTRONIC MODULE AND METHOD FOR PRODUCING AN ELECTRONIC MODULE</title><author>KAESS, Udo ; BAUER, Klaus</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP3646678A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2020</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>KAESS, Udo</creatorcontrib><creatorcontrib>BAUER, Klaus</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KAESS, Udo</au><au>BAUER, Klaus</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ELECTRONIC MODULE AND METHOD FOR PRODUCING AN ELECTRONIC MODULE</title><date>2020-05-06</date><risdate>2020</risdate><abstract>The invention relates to an electronic module (1), which comprises a substrate printed circuit board (2) composed of an insulating material having a first surface (21), a second surface (22) facing away therefrom and a circumferential side face (23) and furthermore metallization areas (24) arranged on the first surface (21) of the substrate printed circuit board (2), electronic components (31, 32), which are electrically contact-connected to the metallization areas (24) on the first surface (21), connection contact faces (26) arranged on the second surface (22) of the substrate printed circuit board (2) and a mould compound (4) arranged over the electronic components (31, 32) on the first surface (21), which mould compound completely covers the first surface (21) over the components (31, 32) up to the circumferential side face (23). It is proposed that a circumferetnial edge region (25), which directly adjoins the circumferential side face (23), on the first surface (21) of the substrate printed circuit board (2) is free of metallization areas (24) and the mould compound (4) in this circumferential edge region (25) is in direct contact with the insulating material of the substrate printed circuit board (2). The invention further relates to a method for producing such an electronic module.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre ; ger |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | ELECTRONIC MODULE AND METHOD FOR PRODUCING AN ELECTRONIC MODULE |
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