ELECTRONIC MODULE AND METHOD FOR PRODUCING AN ELECTRONIC MODULE

The invention relates to an electronic module (1), which comprises a substrate printed circuit board (2) composed of an insulating material having a first surface (21), a second surface (22) facing away therefrom and a circumferential side face (23) and furthermore metallization areas (24) arranged on the first surface (21) of the substrate printed circuit board (2), electronic components (31, 32), which are electrically contact-connected to the metallization areas (24) on the first surface (21), connection contact faces (26) arranged on the second surface (22) of the substrate printed circuit board (2) and a mould compound (4) arranged over the electronic components (31, 32) on the first surface (21), which mould compound completely covers the first surface (21) over the components (31, 32) up to the circumferential side face (23). It is proposed that a circumferetnial edge region (25), which directly adjoins the circumferential side face (23), on the first surface (21) of the substrate printed circuit board (2) is free of metallization areas (24) and the mould compound (4) in this circumferential edge region (25) is in direct contact with the insulating material of the substrate printed circuit board (2). The invention further relates to a method for producing such an electronic module.