HEAT DISSIPATION ASSEMBLY AND MAINBOARD MODULE

A heat dissipation assembly includes a case and a partition structure. The case includes a cavity, a first water hole, and a second water hole, wherein the cavity includes a first region and a second region communicated with each other. The first water hole and the second water hole are communicated...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	MAO, Tai-Chuan, HUANG, Shun-Chih, LIN, Yi-Jhen
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A heat dissipation assembly includes a case and a partition structure. The case includes a cavity, a first water hole, and a second water hole, wherein the cavity includes a first region and a second region communicated with each other. The first water hole and the second water hole are communicated with the first region. The partition structure includes a separation wall and a separation layer connected to each other, wherein the separation wall is vertically disposed in the first region to separate a first flow path and a second flow path disposed in left and right portions in the first region. The separation layer is horizontally disposed in the second region to separate a third flow path and a fourth flow path disposed in upper and lower portions in the second region.