METHOD FOR CURING ADHESIVE COMPOSITION AND METHOD FOR MANUFACTURING ADHESIVE STRUCTURE

A method for curing an adhesive composition includes: arranging an adhesive composition (4) that transmits laser light (L1) of a first wavelength in contact with a surface of a first adherend (1) that contains, at least at its surface, a first light-to-heat conversion material (11) that generates he...

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Bibliographische Detailangaben
Hauptverfasser: HOGA, Yuki, TATSUNO, Yosuke, SATO, Daisuke, KITAMURA, Kyoji, KOMORI, Takekazu
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:A method for curing an adhesive composition includes: arranging an adhesive composition (4) that transmits laser light (L1) of a first wavelength in contact with a surface of a first adherend (1) that contains, at least at its surface, a first light-to-heat conversion material (11) that generates heat by absorbing laser light (L1) of the first wavelength; and curing the adhesive composition (4) by irradiating the adhesive composition (4) and the first adherend (1) with laser light (L1) of the first wavelength. In a method for manufacturing a bonded structure, a first bonded structure (101) is manufactured by bonding the adhesive composition (4) to the first adherend (1) by using the method for curing an adhesive composition. Thus, a method for curing an adhesive composition and a method for manufacturing a bonded structure are provided that stably realize a high degree of adhesion between an adhesive composition and an adherend.