PROCESSING APPARATUS AND PROCESSING METHOD

A processing apparatus is equipped with: a first stage system that has a table (12) on which a workpiece (W) is placed and moves the workpiece held by the table; a beam irradiation system (500) that includes a condensing optical system (530) to emit beams (LB); and a controller to control the first...

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1. Verfasser:	SHIBAZAKI, Yuichi
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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creator	SHIBAZAKI, Yuichi
description	A processing apparatus is equipped with: a first stage system that has a table (12) on which a workpiece (W) is placed and moves the workpiece held by the table; a beam irradiation system (500) that includes a condensing optical system (530) to emit beams (LB); and a controller to control the first stage system and the beam irradiation system, and processing is performed to a target portion of the workpiece while the table and the beams from the condensing optical system are relatively moved, and at least one of an intensity distribution of the beams at a first plane (MP) on an exit surface side of the condensing optical system and an intensity distribution of the beams at a second plane whose position in a direction of an optical axis (AX) of the condensing optical system is different from the first plane can be changed.
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fre ; ger</language><creationdate>2024</creationdate><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>SHIBAZAKI, Yuichi</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SHIBAZAKI, Yuichi</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PROCESSING APPARATUS AND PROCESSING METHOD</title><date>2024-03-27</date><risdate>2024</risdate><abstract>A processing apparatus is equipped with: a first stage system that has a table (12) on which a workpiece (W) is placed and moves the workpiece held by the table; a beam irradiation system (500) that includes a condensing optical system (530) to emit beams (LB); and a controller to control the first stage system and the beam irradiation system, and processing is performed to a target portion of the workpiece while the table and the beams from the condensing optical system are relatively moved, and at least one of an intensity distribution of the beams at a first plane (MP) on an exit surface side of the condensing optical system and an intensity distribution of the beams at a second plane whose position in a direction of an optical axis (AX) of the condensing optical system is different from the first plane can be changed.</abstract><oa>free_for_read</oa></addata></record>
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language	eng ; fre ; ger
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subjects	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
title	PROCESSING APPARATUS AND PROCESSING METHOD
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