PROCESSING APPARATUS AND PROCESSING METHOD

A processing apparatus is equipped with: a first stage system that has a table (12) on which a workpiece (W) is placed and moves the workpiece held by the table; a beam irradiation system (500) that includes a condensing optical system (530) to emit beams (LB); and a controller to control the first...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	SHIBAZAKI, Yuichi
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A processing apparatus is equipped with: a first stage system that has a table (12) on which a workpiece (W) is placed and moves the workpiece held by the table; a beam irradiation system (500) that includes a condensing optical system (530) to emit beams (LB); and a controller to control the first stage system and the beam irradiation system, and processing is performed to a target portion of the workpiece while the table and the beams from the condensing optical system are relatively moved, and at least one of an intensity distribution of the beams at a first plane (MP) on an exit surface side of the condensing optical system and an intensity distribution of the beams at a second plane whose position in a direction of an optical axis (AX) of the condensing optical system is different from the first plane can be changed.