ULTRASOUND IMAGING SYSTEMS HAVING IMPROVED TRANSDUCER ARCHITECTURES

A transducer assembly is provided. The transducer assembly includes a routing layer. The transducer assembly further includes a plurality of transducer elements arranged on a first side of the interposer. The transducer assembly also includes a first application specific integrated circuit (ASIC) ar...

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Bibliographische Detailangaben
Hauptverfasser: FAN, Ying, HAZARD, Christopher Robert, RAO, Naresh Kesavan, RIGBY, Kenneth Wayne
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:A transducer assembly is provided. The transducer assembly includes a routing layer. The transducer assembly further includes a plurality of transducer elements arranged on a first side of the interposer. The transducer assembly also includes a first application specific integrated circuit (ASIC) arranged vertically below the plurality of transducer elements and on a second side of the interposer, wherein the first ASIC comprises a plurality of signal conditioning circuits.