ELECTRIC DEVICE WAFER

ELECTRIC DEVICE WAFER

A device wafer with functional device structures, comprises a semiconductor substrate (SU) as a carrier wafer, a piezoelectric layer (PL) arranged on the carrier wafer and functional device structures (DS) of a first and a second type realized by a structured metallization on top of the piezoelectri...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: MEISTER, Veit, R SLER, Ulrike
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRONIC CIRCUITRY
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
RESONATORS
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Beschreibung
Zusammenfassung:A device wafer with functional device structures, comprises a semiconductor substrate (SU) as a carrier wafer, a piezoelectric layer (PL) arranged on the carrier wafer and functional device structures (DS) of a first and a second type realized by a structured metallization on top of the piezoelectric layer (PL). A space charge region is formed near the top surface of the carrier wafer to yield enhanced electrical isolation between functional device structures (DS) of first and second type.