POLYAMIDE RESIN COMPOSITION AND RELEASE FILM USING SAME

POLYAMIDE RESIN COMPOSITION AND RELEASE FILM USING SAME

An object of the present invention is to provide a polyamide resin composition having improved releasability when made into a film, and a release film using the same. The polyamide resin composition of the present invention comprises a polyamide resin, a non-modified polypropylene resin, and a polyo...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: TAKEUCHI, Shunya, SANO, Hideo, YABU, Naoyasu
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator TAKEUCHI, Shunya
SANO, Hideo
YABU, Naoyasu
description An object of the present invention is to provide a polyamide resin composition having improved releasability when made into a film, and a release film using the same. The polyamide resin composition of the present invention comprises a polyamide resin, a non-modified polypropylene resin, and a polyolefin wax and/or a modified polyethylene resin; wherein the content of the non-modified polypropylene resin is from 0.1 to 10 mass%; and wherein the content of the polyolefin wax and/or the modified polyethylene resin is from 0.1 to 8 mass%. The release film of the present invention comprises the polyamide resin composition described above.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP3632986A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP3632986A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP3632986A13</originalsourceid><addsrcrecordid>eNrjZDAP8PeJdPT1dHFVCHIN9vRTcPb3DfAP9gzx9PdTcPRzAYr6uDoGuyq4efr4KoQCVbgrBDv6uvIwsKYl5hSn8kJpbgYFN9cQZw_d1IL8-NTigsTk1LzUknjXAGMzYyNLCzNHQ2MilAAA8Ggn0Q</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>POLYAMIDE RESIN COMPOSITION AND RELEASE FILM USING SAME</title><source>esp@cenet</source><creator>TAKEUCHI, Shunya ; SANO, Hideo ; YABU, Naoyasu</creator><creatorcontrib>TAKEUCHI, Shunya ; SANO, Hideo ; YABU, Naoyasu</creatorcontrib><description>An object of the present invention is to provide a polyamide resin composition having improved releasability when made into a film, and a release film using the same. The polyamide resin composition of the present invention comprises a polyamide resin, a non-modified polypropylene resin, and a polyolefin wax and/or a modified polyethylene resin; wherein the content of the non-modified polypropylene resin is from 0.1 to 10 mass%; and wherein the content of the polyolefin wax and/or the modified polyethylene resin is from 0.1 to 8 mass%. The release film of the present invention comprises the polyamide resin composition described above.</description><language>eng ; fre ; ger</language><subject>CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20200408&amp;DB=EPODOC&amp;CC=EP&amp;NR=3632986A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20200408&amp;DB=EPODOC&amp;CC=EP&amp;NR=3632986A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TAKEUCHI, Shunya</creatorcontrib><creatorcontrib>SANO, Hideo</creatorcontrib><creatorcontrib>YABU, Naoyasu</creatorcontrib><title>POLYAMIDE RESIN COMPOSITION AND RELEASE FILM USING SAME</title><description>An object of the present invention is to provide a polyamide resin composition having improved releasability when made into a film, and a release film using the same. The polyamide resin composition of the present invention comprises a polyamide resin, a non-modified polypropylene resin, and a polyolefin wax and/or a modified polyethylene resin; wherein the content of the non-modified polypropylene resin is from 0.1 to 10 mass%; and wherein the content of the polyolefin wax and/or the modified polyethylene resin is from 0.1 to 8 mass%. The release film of the present invention comprises the polyamide resin composition described above.</description><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDAP8PeJdPT1dHFVCHIN9vRTcPb3DfAP9gzx9PdTcPRzAYr6uDoGuyq4efr4KoQCVbgrBDv6uvIwsKYl5hSn8kJpbgYFN9cQZw_d1IL8-NTigsTk1LzUknjXAGMzYyNLCzNHQ2MilAAA8Ggn0Q</recordid><startdate>20200408</startdate><enddate>20200408</enddate><creator>TAKEUCHI, Shunya</creator><creator>SANO, Hideo</creator><creator>YABU, Naoyasu</creator><scope>EVB</scope></search><sort><creationdate>20200408</creationdate><title>POLYAMIDE RESIN COMPOSITION AND RELEASE FILM USING SAME</title><author>TAKEUCHI, Shunya ; SANO, Hideo ; YABU, Naoyasu</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP3632986A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2020</creationdate><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>TAKEUCHI, Shunya</creatorcontrib><creatorcontrib>SANO, Hideo</creatorcontrib><creatorcontrib>YABU, Naoyasu</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TAKEUCHI, Shunya</au><au>SANO, Hideo</au><au>YABU, Naoyasu</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>POLYAMIDE RESIN COMPOSITION AND RELEASE FILM USING SAME</title><date>2020-04-08</date><risdate>2020</risdate><abstract>An object of the present invention is to provide a polyamide resin composition having improved releasability when made into a film, and a release film using the same. The polyamide resin composition of the present invention comprises a polyamide resin, a non-modified polypropylene resin, and a polyolefin wax and/or a modified polyethylene resin; wherein the content of the non-modified polypropylene resin is from 0.1 to 10 mass%; and wherein the content of the polyolefin wax and/or the modified polyethylene resin is from 0.1 to 8 mass%. The release film of the present invention comprises the polyamide resin composition described above.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng ; fre ; ger
recordid cdi_epo_espacenet_EP3632986A1
source esp@cenet
subjects CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
title POLYAMIDE RESIN COMPOSITION AND RELEASE FILM USING SAME
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-23T15%3A17%3A59IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=TAKEUCHI,%20Shunya&rft.date=2020-04-08&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP3632986A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true