POLYAMIDE RESIN COMPOSITION AND RELEASE FILM USING SAME

An object of the present invention is to provide a polyamide resin composition having improved releasability when made into a film, and a release film using the same. The polyamide resin composition of the present invention comprises a polyamide resin, a non-modified polypropylene resin, and a polyo...

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Bibliographische Detailangaben
Hauptverfasser:	TAKEUCHI, Shunya, SANO, Hideo, YABU, Naoyasu
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	An object of the present invention is to provide a polyamide resin composition having improved releasability when made into a film, and a release film using the same. The polyamide resin composition of the present invention comprises a polyamide resin, a non-modified polypropylene resin, and a polyolefin wax and/or a modified polyethylene resin; wherein the content of the non-modified polypropylene resin is from 0.1 to 10 mass%; and wherein the content of the polyolefin wax and/or the modified polyethylene resin is from 0.1 to 8 mass%. The release film of the present invention comprises the polyamide resin composition described above.