CURABLE PRECURSOR OF A STRUCTURAL ADHESIVE COMPOSITION

The present disclosure relates to a curable precursor of a structural adhesive composition, comprising:a) a cationically self-polymerizable monomer;b) a polymerization initiator of the cationically self-polymerizable monomer which is initiated at a temperature T1;c) a curable monomer which is differ...

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Bibliographische Detailangaben
Hauptverfasser:	Hasenberg, Dirk, Ludewig, Olaf, Cura, Elisabeth, Jung, Adrian, Tasch, Boris
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON DYES GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES WORKING-UP
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Beschreibung
Zusammenfassung:	The present disclosure relates to a curable precursor of a structural adhesive composition, comprising:a) a cationically self-polymerizable monomer;b) a polymerization initiator of the cationically self-polymerizable monomer which is initiated at a temperature T1;c) a curable monomer which is different from the cationically self-polymerizable monomer; andd) a curing initiator of the curable monomer which is initiated at a temperature T2 and which is different from the polymerization initiator of the cationically self-polymerizable monomer.According to another aspect, the present disclosure is directed to a partially cured precursor of a structural adhesive composition. According to still another aspect, the present disclosure relates to a method of bonding to parts. In yet another aspect, the disclosure relates to the use of a curable precursor or a partially cured precursor as described above, for industrial applications, in particular for body-in-white bonding applications for the automotive industry.