HEAT SINK ARRANGEMENT

A heat sink arrangement with a composite layer is disclosed. In an embodiment, the arrangement includes a heatsink with a roughened metallic surface, a first dam disposed on an outer perimeter of the heatsink, and a matrix composite layer disposed on the roughened metallic surface and contained by t...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Narayanasamy, Jayaganasan, Lau, Kok Tee, Murugan, Sanjay Kumar, Lee, Hong Lim, Krishnan, Jagen
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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