HEAT SINK ARRANGEMENT

A heat sink arrangement with a composite layer is disclosed. In an embodiment, the arrangement includes a heatsink with a roughened metallic surface, a first dam disposed on an outer perimeter of the heatsink, and a matrix composite layer disposed on the roughened metallic surface and contained by t...

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Bibliographische Detailangaben
Hauptverfasser:	Narayanasamy, Jayaganasan, Lau, Kok Tee, Murugan, Sanjay Kumar, Lee, Hong Lim, Krishnan, Jagen
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A heat sink arrangement with a composite layer is disclosed. In an embodiment, the arrangement includes a heatsink with a roughened metallic surface, a first dam disposed on an outer perimeter of the heatsink, and a matrix composite layer disposed on the roughened metallic surface and contained by the first dam, wherein the matrix composite layer comprises a ceramic filler material and a plastic material, and wherein the ceramic filler material includes two or three dimensional particles, platelets, agglomerated particles or a combination thereof.